Dual-chip 1x9

Features

1. The dual-chip optical module separates the core functions of the transmitter and receiver into two dedicated chips (laser driver chip + receiver signal processing chip).

• Strong functional isolation
• Reducing signal crosstalk
• Optimize the design separately for transmission and reception

2. The dual-chip design enables more sophisticated chromatic dispersion compensation and signal equalization capabilities. Its architecture enables the independent optimization of the transmitter's precise laser modulation control (e.g., for EML lasers), thereby enhancing signal purity. The receriver enhances signal amplification and noise suppression (e.g., APD+TIA configuration), improving sensitivity.

3. The laser diode's significant heat generation necessitates a dedicated transmitter chip design for optimized thermal management, preventing heat-induced degradation of receiver circuitry (e.g., temperature drift in transimpedance amplifiers).

4. The modular dual-chip design enables independent upgrades of the transmitter and receiver modules. This dual-chip architecture enables sophisticated operations in high-speed coherent optical modules:

• Transmitter-side: DSP processing and advanced modulation (QPSK/16QAM)
• Receiver-side: Polarization recovery and FEC decoding.

5. Fault containment is achieved by physical separation:

• Independent TX/RX operation
• Graceful degradation (e.g., maintain TX capability during RX failure)

6. The dual-chip modular design simplifies maintenance and testing by enabling independent performance validation of transmitter or receiver components, significantly reducing production debugging complexity.

Scenario

Rate Support:

• 155Mbps/622Mbps/1.25Gbps
• Dual fiber mode: SMF/MMF

Interface Options:

• SC/FC/ST connectors

Applications:

• Telecom: Optical terminals, Switches (include media converter, optical routers)
• Industrial:CAN-to-fiber repeaters
• Aerospace: UAV communications

Production Selection